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PA0187 Product Attributes
Part Number :PA0187
Manufacturer :Chip Quik Inc.
Description :TO-263-9 DDPAK/D2PAK TO DIP-18 S
Series :Proto-Advantage
Part Status :Active
Proto Board Type :SMD to DIP
Package Accepted :TO-263 (DDPAK/D2PAK)
Number of Positions :9
Pitch :0.038" (0.97mm)
Board Thickness :0.062" (1.57mm) 1/16"
Material :FR4 Epoxy Glass
Size / Dimension :0.700" x 1.000" (17.78mm x 25.40mm)