Manufacturer :
Chip Quik Inc.
Description :
MINI SOIC-10 EXP PAD TO DIP-10 S
Proto Board Type :
SMD to DIP
Package Accepted :
MiniSOIC EP
Board Thickness :
0.062" (1.57mm) 1/16"
Material :
FR4 Epoxy Glass
Size / Dimension :
0.700" x 0.500" (17.78mm x 12.70mm)