If your location is not listed, please select one of the following:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski

If your location is not listed, please select one of the following:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Home
  2. Products
  3. DRAM
  4. DDR3
  5. K4B4G0846D-BCH9

Samsung Semiconductor - K4B4G0846D-BCH9

KEY Part #: K7359667

[19788pcs Stock]

    Part Number:
    K4B4G0846D-BCH9
    Manufacturer:
    Samsung Semiconductor
    Detailed description:
    4 Gb 512M x 8 1333 Mbps 1.5 V 0 ~ 85 °C 78FBGA Mass Production.
    Manufacturer's standard lead time:
    In stock
    Shelf life:
    One Year
    Chip From:
    Hong Kong
    RoHS:
    Payment method:
    Shipment way:
    Family Categories:
    KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : LPDDR4, DDR4, LPDDR5, HBM Flarebolt, HBM Aquabolt, MODULE, GDDR6 and GDDR5 ...
    Competitive Advantage:
    We specialize in Samsung Semiconductor K4B4G0846D-BCH9 electronic components. K4B4G0846D-BCH9 can be shipped within 24 hours after order. If you have any demands for K4B4G0846D-BCH9, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4B4G0846D-BCH9 Product Attributes

    Part Number : K4B4G0846D-BCH9
    Manufacturer : Samsung Semiconductor
    Description : 4 Gb 512M x 8 1333 Mbps 1.5 V 0 ~ 85 °C 78FBGA Mass Production
    Series : DDR3
    Density : 4 Gb
    Org. : 512M x 8
    Speed : 1333 Mbps
    Voltage : 1.5 V
    Temp. : 0 ~ 85 °C
    Package : 78FBGA

    Latest News

    Mission Peak Reference Server System for NGSFF SSD
    [Video] 5G memory solutions : 5G. All in the Memory.
    Samsung Begins Mass Production of Industry’s First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones
    High Bandwidth Memory is Catching on for Data-intensive Computing
    Samsung Showcases Its Latest Silicon Technologies for the Next Wave of Innovation at Annual Tech Day
    Bringing Artificial Intelligence to Devices Everywhere
    5G and Memory - from Connected Thinking to Connected Living
    Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
    The Ultra-Low Latency SSD, Z-SSD
    Samsung Electronics Begins Mass Production of Industry's First 12GB LPDDR4X-based uMCP
    Automotive Driven by Small Packages Under the Hood
    Inside the building blocks of the 5G future
    You May Also Be Interested In
    • K3UH5H50AM-AGCL

      Samsung Semiconductor

      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.

    • K3UH5H50AM-EGCL

      Samsung Semiconductor

      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.

    • K3UH5H50AM-JGCL

      Samsung Semiconductor

      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 432FBGA Mass Production.

    • K3UH6H60BM-AGCL

      Samsung Semiconductor

      48 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.

    • K3UH6H60BM-EGCL

      Samsung Semiconductor

      48 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.

    • K3UH7H70AM-AGCL

      Samsung Semiconductor

      64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.

    Hot Parts