EPC2019 Pricing (USD) [53015pcs Stock]
- 1 pcs$0.81534
- 1,000 pcs$0.81128
- Part Number:
- EPC2019
- Manufacturer:
- EPC
- Detailed description:
- GAN TRANS 200V 8.5A BUMPED DIE.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Power Driver Modules, Diodes - Bridge Rectifiers, Transistors - Bipolar (BJT) - Arrays, Pre-Biased, Transistors - Programmable Unijunction, Transistors - IGBTs - Modules, Diodes - Zener - Single, Transistors - FETs, MOSFETs - Single and Transistors - Bipolar (BJT) - Arrays ...
- Competitive Advantage:
- We specialize in EPC EPC2019 electronic components. EPC2019 can be shipped within 24 hours after order. If you have any demands for EPC2019, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
EPC2019 Product Attributes
Part Number :
EPC2019
Manufacturer :
EPC
Description :
GAN TRANS 200V 8.5A BUMPED DIE
Series :
eGaN®
Part Status :
Active
FET Type :
N-Channel
Technology :
GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) :
200V
Current - Continuous Drain (Id) @ 25°C :
8.5A (Ta)
Drive Voltage (Max Rds On, Min Rds On) :
5V
Rds On (Max) @ Id, Vgs :
50 mOhm @ 7A, 5V
Vgs(th) (Max) @ Id :
2.5V @ 1.5mA
Gate Charge (Qg) (Max) @ Vgs :
2.5nC @ 5V
Vgs (Max) :
+6V, -4V
Input Capacitance (Ciss) (Max) @ Vds :
270pF @ 100V
FET Feature :
-
Power Dissipation (Max) :
-
Operating Temperature :
-40°C ~ 150°C (TJ)
Mounting Type :
Surface Mount
Supplier Device Package :
Die
Package / Case :
Die
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