Advanced Thermal Solutions Inc. - ATS-56010-C3-R0

KEY Part #: K6263834

ATS-56010-C3-R0 Pricing (USD) [7457pcs Stock]

  • 1 pcs$5.18263
  • 10 pcs$4.89574
  • 25 pcs$4.60778
  • 50 pcs$4.31974
  • 100 pcs$4.03179
  • 250 pcs$3.74380
  • 500 pcs$3.67180
  • 1,000 pcs$3.59981

Part Number:
ATS-56010-C3-R0
Manufacturer:
Advanced Thermal Solutions Inc.
Detailed description:
HEAT SINK 50MM X 45MM X 8.5MM. Heat Sinks maxiFLOW BGA ASIC Cooling Heatsink, Saint-Gobain C675, 50x45x8.5mm
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Fans - Accessories - Fan Cords, Thermal - Liquid Cooling, Thermal - Thermoelectric, Peltier Assemblies, Thermal - Accessories, Fans - Accessories, Thermal - Pads, Sheets, AC Fans and Thermal - Thermoelectric, Peltier Modules ...
Competitive Advantage:
We specialize in Advanced Thermal Solutions Inc. ATS-56010-C3-R0 electronic components. ATS-56010-C3-R0 can be shipped within 24 hours after order. If you have any demands for ATS-56010-C3-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-56010-C3-R0 Product Attributes

Part Number : ATS-56010-C3-R0
Manufacturer : Advanced Thermal Solutions Inc.
Description : HEAT SINK 50MM X 45MM X 8.5MM
Series : maxiFLOW
Part Status : Active
Type : Top Mount
Package Cooled : ASIC
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Rectangular, Angled Fins
Length : 1.969" (50.00mm)
Width : 1.772" (45.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.335" (8.50mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 4.00°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized

You May Also Be Interested In
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3-50.8-12.7-0.21-1A

    t-Global Technology

    PH3 50.8X12.07X0.21MM.