Manufacturer :
Aries Electronics
Description :
CONN IC DIP SOCKET 30POS GOLD
Series :
Lo-PRO®file, 513
Type :
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) :
30 (2 x 15)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Tin
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Post :
Brass
Housing Material :
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature :
-55°C ~ 105°C