Part Number :
B39202B8823P810
Manufacturer :
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Applications :
Cellular, WCDMA
Mounting Type :
Surface Mount
Package / Case :
5-SMD, No Lead
Height (Max) :
0.018" (0.45mm)
Size / Dimension :
0.043" L x 0.035" W (1.10mm x 0.90mm)