Laird Technologies EMI - 67SLG100100100PI00

KEY Part #: K7280912

67SLG100100100PI00 Pricing (USD) [145399pcs Stock]

  • 1 pcs$0.25439
  • 300 pcs$0.24690
  • 600 pcs$0.21013
  • 900 pcs$0.18386
  • 1,500 pcs$0.16810
  • 2,100 pcs$0.15234
  • 7,500 pcs$0.14184
  • 15,000 pcs$0.13659
  • 30,000 pcs$0.13133

Part Number:
67SLG100100100PI00
Manufacturer:
Laird Technologies EMI
Detailed description:
METAL FILM OVER FOAM CONTACTS. EMI Gaskets, Sheets, Absorbers & Shielding Rect. Film-over-Foam Sn/Cu 10x10x10mm
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Attenuators, RF Power Dividers/Splitters, RF Directional Coupler, RF Switches, RF Shields, RF Transmitters, RF Evaluation and Development Kits, Boards and RF Misc ICs and Modules ...
Competitive Advantage:
We specialize in Laird Technologies EMI 67SLG100100100PI00 electronic components. 67SLG100100100PI00 can be shipped within 24 hours after order. If you have any demands for 67SLG100100100PI00, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

67SLG100100100PI00 Product Attributes

Part Number : 67SLG100100100PI00
Manufacturer : Laird Technologies EMI
Description : METAL FILM OVER FOAM CONTACTS
Series : SMD Grounding Metallized
Part Status : Active
Type : Film Over Foam
Shape : Rectangle
Width : 0.394" (10.00mm)
Length : 0.394" (10.00mm)
Height : 0.394" (10.00mm)
Material : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating : -
Plating - Thickness : -
Attachment Method : Solder
Operating Temperature : -40°C ~ 70°C

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