HF115AC-0.0055-AC-90 Pricing (USD) [935213pcs Stock]
- 1 pcs$0.03955
- 10 pcs$0.03441
- 50 pcs$0.03085
- 100 pcs$0.02729
- 500 pcs$0.02373
- 1,000 pcs$0.01780
- 5,000 pcs$0.01542
- Part Number:
- HF115AC-0.0055-AC-90
- Manufacturer:
- Bergquist
- Detailed description:
- THERM PAD 21.84MMX18.79MM W/ADH.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Thermal - Thermoelectric, Peltier Modules, Thermal - Adhesives, Epoxies, Greases, Pastes, Thermal - Pads, Sheets, Fans - Accessories, Thermal - Accessories, Fans - Accessories - Fan Cords, Thermal - Liquid Cooling and AC Fans ...
- Competitive Advantage:
- We specialize in Bergquist HF115AC-0.0055-AC-90 electronic components. HF115AC-0.0055-AC-90 can be shipped within 24 hours after order. If you have any demands for HF115AC-0.0055-AC-90, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
HF115AC-0.0055-AC-90 Product Attributes
Part Number :
HF115AC-0.0055-AC-90
Manufacturer :
Bergquist
Description :
THERM PAD 21.84MMX18.79MM W/ADH
Series :
Hi-Flow® 115-AC
Part Status :
Active
Usage :
TO-218, TO-220, TO-247
Type :
Pad, Sheet
Shape :
Rectangular
Outline :
21.84mm x 18.79mm
Thickness :
0.0055" (0.140mm)
Material :
Phase Change Compound
Adhesive :
Adhesive - One Side
Backing, Carrier :
Fiberglass
Color :
Gray
Thermal Resistivity :
0.35°C/W
Thermal Conductivity :
0.8 W/m-K
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