Laird Technologies EMI - 67SLG040040025PI00

KEY Part #: K7264550

67SLG040040025PI00 Pricing (USD) [726097pcs Stock]

  • 1 pcs$0.05094
  • 1,800 pcs$0.04912
  • 3,600 pcs$0.04421
  • 5,400 pcs$0.04175
  • 12,600 pcs$0.03807
  • 45,000 pcs$0.03561
  • 90,000 pcs$0.03193

Part Number:
67SLG040040025PI00
Manufacturer:
Laird Technologies EMI
Detailed description:
METAL FILM OVER FOAM CONTACTS. EMI Gaskets, Sheets, Absorbers & Shielding Rect. Film-over-Foam Sn/Cu 4x4x2.5mm
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : RFID Accessories, RF Power Dividers/Splitters, RF Demodulators, RF Power Controller ICs, RF Receiver, Transmitter, and Transceiver Finished Units, RF Transmitters, RF Directional Coupler and RF Diplexers ...
Competitive Advantage:
We specialize in Laird Technologies EMI 67SLG040040025PI00 electronic components. 67SLG040040025PI00 can be shipped within 24 hours after order. If you have any demands for 67SLG040040025PI00, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

67SLG040040025PI00 Product Attributes

Part Number : 67SLG040040025PI00
Manufacturer : Laird Technologies EMI
Description : METAL FILM OVER FOAM CONTACTS
Series : SMD Grounding Metallized
Part Status : Active
Type : Film Over Foam
Shape : Rectangle
Width : 0.157" (4.00mm)
Length : 0.098" (2.50mm)
Height : 0.157" (4.00mm)
Material : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating : -
Plating - Thickness : -
Attachment Method : Solder
Operating Temperature : -40°C ~ 70°C

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