Manufacturer :
TE Connectivity AMP Connectors
Description :
CONN IC DIP SOCKET 20POS GOLD
Type :
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) :
20 (2 x 10)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
20.0µin (0.51µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole, Right Angle, Horizontal
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
-
Contact Finish Thickness - Post :
-
Contact Material - Post :
Brass
Housing Material :
Thermoplastic, Polyester
Operating Temperature :
-