TE Connectivity AMP Connectors - 808-AG11D-LF

KEY Part #: K3362007

808-AG11D-LF Pricing (USD) [60727pcs Stock]

  • 1 pcs$0.64387

Part Number:
808-AG11D-LF
Manufacturer:
TE Connectivity AMP Connectors
Detailed description:
CONN IC DIP SOCKET 8POS GOLD. IC & Component Sockets DIP .3CL 08P S/M OFRM AU/SN
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Heavy Duty Connectors - Housings, Hoods, Bases, Sockets for ICs, Transistors - Accessories, Coaxial Connectors (RF) - Contacts, Modular Connectors - Plugs, Barrel - Accessories, Banana and Tip Connectors - Accessories, Modular Connectors - Accessories and Rectangular Connectors - Contacts ...
Competitive Advantage:
We specialize in TE Connectivity AMP Connectors 808-AG11D-LF electronic components. 808-AG11D-LF can be shipped within 24 hours after order. If you have any demands for 808-AG11D-LF, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

808-AG11D-LF Product Attributes

Part Number : 808-AG11D-LF
Manufacturer : TE Connectivity AMP Connectors
Description : CONN IC DIP SOCKET 8POS GOLD
Series : 800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 8 (2 x 4)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 25.0µin (0.63µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 25.0µin (0.63µm)
Contact Material - Post : Copper
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature : -55°C ~ 105°C