Part Number :
70-4006-2010
Manufacturer :
Kester Solder
Description :
SOLDER PASTE NO CLEAN 500GM
Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point :
423 ~ 424°F (217 ~ 218°C)
Form :
Jar, 17.64 oz (500g)
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
32°F ~ 50°F (0°C ~ 10°C)