Part Number :
130-028-000
Description :
CONN IC DIP SOCKET 28POS GOLD
Type :
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) :
28 (2 x 14)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
8.00µin (0.203µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Gold
Contact Finish Thickness - Post :
Flash
Contact Material - Post :
Brass
Housing Material :
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature :
-65°C ~ 125°C