BGM12LBA9E6327XTSA1 Pricing (USD) [376342pcs Stock]
- 1 pcs$0.09877
- 4,500 pcs$0.09828
- Part Number:
- BGM12LBA9E6327XTSA1
- Manufacturer:
- Infineon Technologies
- Detailed description:
- MULTI CHIP MODULES.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : RFID Reader Modules, RF Mixers, RF Receivers, RFI and EMI - Contacts, Fingerstock and Gaskets, RF Switches, RFI and EMI - Shielding and Absorbing Materials, RF Detectors and RF Receiver, Transmitter, and Transceiver Finished Units ...
- Competitive Advantage:
- We specialize in Infineon Technologies BGM12LBA9E6327XTSA1 electronic components. BGM12LBA9E6327XTSA1 can be shipped within 24 hours after order. If you have any demands for BGM12LBA9E6327XTSA1, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BGM12LBA9E6327XTSA1 Product Attributes
Part Number :
BGM12LBA9E6327XTSA1
Manufacturer :
Infineon Technologies
Description :
MULTI CHIP MODULES
Series :
-
Part Status :
Active
RF Family/Standard :
Bluetooth
Protocol :
802.11a/b/g/n, Bluetooth v4.0
Modulation :
16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Frequency :
703MHz ~ 960MHz
Data Rate :
54Mbps
Power - Output :
-5dBm
Sensitivity :
-
Serial Interfaces :
SPI, USB
Antenna Type :
-
Utilized IC / Part :
-
Memory Size :
-
Voltage - Supply :
1.6V ~ 3.1V
Current - Receiving :
-
Current - Transmitting :
-
Mounting Type :
Surface Mount
Operating Temperature :
-40°C ~ 85°C
Package / Case :
-
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