Manufacturer :
TE Connectivity AMP Connectors
Description :
CONN IC DIP SOCKET 28POS GOLD
Type :
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) :
28 (2 x 14)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Gold
Contact Finish Thickness - Post :
30.0µin (0.76µm)
Contact Material - Post :
Beryllium Copper
Housing Material :
Thermoplastic, Glass Filled
Operating Temperature :
-55°C ~ 125°C