DILB32P-223TLF Pricing (USD) [194835pcs Stock]
- 1 pcs$0.18984
- 10,800 pcs$0.07555
- Part Number:
- DILB32P-223TLF
- Manufacturer:
- Amphenol ICC (FCI)
- Detailed description:
- CONN IC DIP SOCKET 32POS TINLEAD. IC & Component Sockets SOCKETS DIP
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Backplane Connectors - Specialized, Coaxial Connectors (RF) - Accessories, D-Sub, D-Shaped Connectors - Accessories - Jackscrews, Terminals - Foil Connectors, Contacts, Spring Loaded and Pressure, Terminal Blocks - Din Rail, Channel, Keystone - Inserts and Terminal Blocks - Accessories - Wire Ferrules ...
- Competitive Advantage:
- We specialize in Amphenol ICC (FCI) DILB32P-223TLF electronic components. DILB32P-223TLF can be shipped within 24 hours after order. If you have any demands for DILB32P-223TLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DILB32P-223TLF Product Attributes
Part Number :
DILB32P-223TLF
Manufacturer :
Amphenol ICC (FCI)
Description :
CONN IC DIP SOCKET 32POS TINLEAD
Series :
DILB
Part Status :
Active
Type :
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) :
32 (2 x 16)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Tin-Lead
Contact Finish Thickness - Mating :
100.0µin (2.54µm)
Contact Material - Mating :
Copper Alloy
Mounting Type :
Through Hole
Features :
Open Frame
Termination :
Solder
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Post :
100.0µin (2.54µm)
Contact Material - Post :
Copper Alloy
Housing Material :
Polyamide (PA), Nylon
Operating Temperature :
-55°C ~ 125°C
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