Manufacturer :
Aries Electronics
Description :
CONN IC DIP SOCKET ZIF 40POS TIN
Type :
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) :
40 (2 x 20)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Tin
Contact Finish Thickness - Mating :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Tin
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Post :
Beryllium Copper
Housing Material :
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature :
-