BDN15-3CB/A01 Pricing (USD) [44465pcs Stock]
- 1 pcs$0.87934
- 1,000 pcs$0.81421
- Part Number:
- BDN15-3CB/A01
- Manufacturer:
- CTS Thermal Management Products
- Detailed description:
- HEATSINK CPU W/ADHESIVE 1.51SQ.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Thermal - Adhesives, Epoxies, Greases, Pastes, Thermal - Accessories, Fans - Accessories - Fan Cords, Fans - Accessories, Thermal - Heat Pipes, Vapor Chambers, Thermal - Pads, Sheets, Thermal - Thermoelectric, Peltier Assemblies and Thermal - Liquid Cooling ...
- Competitive Advantage:
- We specialize in CTS Thermal Management Products BDN15-3CB/A01 electronic components. BDN15-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN15-3CB/A01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BDN15-3CB/A01 Product Attributes
Part Number :
BDN15-3CB/A01
Manufacturer :
CTS Thermal Management Products
Description :
HEATSINK CPU W/ADHESIVE 1.51SQ
Series :
BDN
Part Status :
Active
Type :
Top Mount
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method :
Thermal Tape, Adhesive (Included)
Shape :
Square, Pin Fins
Length :
1.510" (38.35mm)
Width :
1.510" (38.35mm)
Diameter :
-
Height Off Base (Height of Fin) :
0.355" (9.02mm)
Power Dissipation @ Temperature Rise :
-
Thermal Resistance @ Forced Air Flow :
4.50°C/W @ 400 LFM
Thermal Resistance @ Natural :
15.10°C/W
Material :
Aluminum
Material Finish :
Black Anodized
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