Laird Technologies EMI - 67SLG040035030PI00

KEY Part #: K7287347

67SLG040035030PI00 Pricing (USD) [807960pcs Stock]

  • 1 pcs$0.04854
  • 2,000 pcs$0.04830
  • 6,000 pcs$0.04562
  • 10,000 pcs$0.04159
  • 50,000 pcs$0.03489
  • 100,000 pcs$0.03435

Part Number:
67SLG040035030PI00
Manufacturer:
Laird Technologies EMI
Detailed description:
METAL FILM OVER FOAM CONTACTS. EMI Gaskets, Sheets, Absorbers & Shielding Rect. Film-over-Foam Sn/Cu 4x3.5x3mm
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : RFID Antennas, RF Modulators, RF Transceiver Modules, RF Transceiver ICs, RFID, RF Access, Monitoring ICs, RFI and EMI - Shielding and Absorbing Materials, RF Front End (LNA + PA) and RF Accessories ...
Competitive Advantage:
We specialize in Laird Technologies EMI 67SLG040035030PI00 electronic components. 67SLG040035030PI00 can be shipped within 24 hours after order. If you have any demands for 67SLG040035030PI00, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

67SLG040035030PI00 Product Attributes

Part Number : 67SLG040035030PI00
Manufacturer : Laird Technologies EMI
Description : METAL FILM OVER FOAM CONTACTS
Series : SMD Grounding Metallized
Part Status : Active
Type : Film Over Foam
Shape : Rectangle
Width : 0.157" (4.00mm)
Length : 0.118" (3.00mm)
Height : 0.138" (3.50mm)
Material : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating : -
Plating - Thickness : -
Attachment Method : Solder
Operating Temperature : -40°C ~ 70°C

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