Laird Technologies - Thermal Materials - OTH-Q81771C-00-DN5

KEY Part #: K6153183

OTH-Q81771C-00-DN5 Pricing (USD) [564878pcs Stock]

  • 1 pcs$0.20050
  • 9 pcs$0.19951
  • 18 pcs$0.18984
  • 27 pcs$0.18032
  • 63 pcs$0.17559
  • 225 pcs$0.17323
  • 450 pcs$0.16136
  • 900 pcs$0.15187

Part Number:
OTH-Q81771C-00-DN5
Manufacturer:
Laird Technologies - Thermal Materials
Detailed description:
THERM PAD 10MMX10MM GRAY.
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Thermal - Heat Pipes, Vapor Chambers, Fans - Finger Guards, Filters & Sleeves, Thermal - Adhesives, Epoxies, Greases, Pastes, Thermal - Liquid Cooling, DC Fans, AC Fans, Fans - Accessories and Thermal - Pads, Sheets ...
Competitive Advantage:
We specialize in Laird Technologies - Thermal Materials OTH-Q81771C-00-DN5 electronic components. OTH-Q81771C-00-DN5 can be shipped within 24 hours after order. If you have any demands for OTH-Q81771C-00-DN5, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

OTH-Q81771C-00-DN5 Product Attributes

Part Number : OTH-Q81771C-00-DN5
Manufacturer : Laird Technologies - Thermal Materials
Description : THERM PAD 10MMX10MM GRAY
Series : Tpcm™ 580
Part Status : Active
Usage : -
Type : Phase Change Pad, Sheet
Shape : Square
Outline : 10.00mm x 10.00mm
Thickness : 0.0080" (0.203mm)
Material : Phase Change Compound
Adhesive : Tacky - Both Sides
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 3.8 W/m-K

You May Also Be Interested In
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft