Manufacturer :
Chip Quik Inc.
Description :
THERMALLY STABLE SOLDER PASTE NO
Composition :
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Melting Point :
281°F (138°C)
Form :
Jar, 8.8 oz (250g)
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
68°F ~ 77°F (20°C ~ 25°C)