Manufacturer :
Omron Electronics Inc-EMC Div
Description :
CONN IC DIP SOCKET 8POS GOLD
Type :
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) :
8 (2 x 4)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Material - Mating :
Beryllium Copper
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Gold
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Post :
Brass
Housing Material :
Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature :
-55°C ~ 125°C