Omron Electronics Inc-EMC Div - XR2A-2811-N

KEY Part #: K3360139

XR2A-2811-N Pricing (USD) [26066pcs Stock]

  • 1 pcs$1.58898
  • 17 pcs$1.58108

Part Number:
XR2A-2811-N
Manufacturer:
Omron Electronics Inc-EMC Div
Detailed description:
CONN IC DIP SOCKET 28POS GOLD. IC & Component Sockets Socket DIP Term 28P 15.24mm .25AuPlate
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Rectangular Connectors - Free Hanging, Panel Mount, Backplane Connectors - Housings, D-Sub, D-Shaped Connectors - Adapters, Keystone - Faceplates, Frames, FFC, FPC (Flat Flexible) Connectors - Accessories, Modular Connectors - Jacks With Magnetics, LGH Connectors and D-Sub, D-Shaped Connectors - Backshells, Hoods ...
Competitive Advantage:
We specialize in Omron Electronics Inc-EMC Div XR2A-2811-N electronic components. XR2A-2811-N can be shipped within 24 hours after order. If you have any demands for XR2A-2811-N, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

XR2A-2811-N Product Attributes

Part Number : XR2A-2811-N
Manufacturer : Omron Electronics Inc-EMC Div
Description : CONN IC DIP SOCKET 28POS GOLD
Series : XR2
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature : -55°C ~ 125°C