Part Number :
XR2A-2811-N
Manufacturer :
Omron Electronics Inc-EMC Div
Description :
CONN IC DIP SOCKET 28POS GOLD
Type :
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) :
28 (2 x 14)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Gold
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Post :
Beryllium Copper
Housing Material :
Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature :
-55°C ~ 125°C