BDN09-3CB Pricing (USD) [48708pcs Stock]
- 1 pcs$0.71077
- 10 pcs$0.67523
- 25 pcs$0.65742
- 50 pcs$0.63969
- 100 pcs$0.60415
- 250 pcs$0.56862
- 500 pcs$0.53308
- 1,000 pcs$0.49754
- 5,000 pcs$0.47977
- Part Number:
- BDN09-3CB
- Manufacturer:
- CTS Thermal Management Products
- Detailed description:
- HEATSINK CPU .91 SQ.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Thermal - Adhesives, Epoxies, Greases, Pastes, Thermal - Liquid Cooling, Thermal - Heat Sinks, Thermal - Thermoelectric, Peltier Modules, Thermal - Accessories, Thermal - Heat Pipes, Vapor Chambers, AC Fans and Fans - Accessories - Fan Cords ...
- Competitive Advantage:
- We specialize in CTS Thermal Management Products BDN09-3CB electronic components. BDN09-3CB can be shipped within 24 hours after order. If you have any demands for BDN09-3CB, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BDN09-3CB Product Attributes
Part Number :
BDN09-3CB
Manufacturer :
CTS Thermal Management Products
Description :
HEATSINK CPU .91 SQ
Series :
BDN
Part Status :
Active
Type :
Top Mount
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Shape :
Square, Pin Fins
Length :
0.910" (23.11mm)
Width :
0.910" (23.11mm)
Diameter :
-
Height Off Base (Height of Fin) :
0.355" (9.02mm)
Power Dissipation @ Temperature Rise :
-
Thermal Resistance @ Forced Air Flow :
9.60°C/W @ 400 LFM
Thermal Resistance @ Natural :
26.90°C/W
Material :
Aluminum
Material Finish :
Black Anodized
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