Manufacturer :
Aries Electronics
Description :
CONN IC DIP SOCKET 18POS GOLD
Type :
DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) :
18 (2 x 9)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Gold
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Post :
Brass
Housing Material :
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature :
-