290-1294-00-3302J Pricing (USD) [2007pcs Stock]
- 1 pcs$20.54272
- 10 pcs$19.33258
- 25 pcs$18.72844
- 50 pcs$17.52015
- 100 pcs$16.55352
- 250 pcs$16.07021
- Part Number:
- 290-1294-00-3302J
- Manufacturer:
- 3M
- Detailed description:
- CONN IC DIP SOCKET ZIF 90POS GLD. IC & Component Sockets 0.070" DIP SOCKET 90 Contact Qty.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Terminals - Quick Connects, Quick Disconnect Connectors, Heavy Duty Connectors - Housings, Hoods, Bases, Terminals - Wire to Board Connectors, Photovoltaic (Solar Panel) Connectors - Contacts, D-Sub, D-Shaped Connectors - Contacts, Modular Connectors - Accessories, Coaxial Connectors (RF) - Adapters and Rectangular Connectors - Adapters ...
- Competitive Advantage:
- We specialize in 3M 290-1294-00-3302J electronic components. 290-1294-00-3302J can be shipped within 24 hours after order. If you have any demands for 290-1294-00-3302J, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
290-1294-00-3302J Product Attributes
Part Number :
290-1294-00-3302J
Manufacturer :
3M
Description :
CONN IC DIP SOCKET ZIF 90POS GLD
Series :
Textool™
Part Status :
Active
Type :
DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) :
90 (2 x 45)
Pitch - Mating :
0.070" (1.78mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole
Features :
Closed Frame
Termination :
Solder
Pitch - Post :
0.070" (1.78mm)
Contact Finish - Post :
Gold
Contact Finish Thickness - Post :
30.0µin (0.76µm)
Contact Material - Post :
Beryllium Copper
Housing Material :
Polysulfone (PSU), Glass Filled
Operating Temperature :
-55°C ~ 125°C
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