518-AG11D-ES Pricing (USD) [30764pcs Stock]
- 1 pcs$1.33967
- 520 pcs$0.88889
- Part Number:
- 518-AG11D-ES
- Manufacturer:
- TE Connectivity AMP Connectors
- Detailed description:
- CONN IC DIP SOCKET 18POS GOLD.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Power Entry Connectors - Inlets, Outlets, Modules, Circular Connectors - Backshells and Cable Clamps, Rectangular Connectors - Board In, Direct Wire to Board, Memory Connectors - Accessories, Card Edge Connectors - Edgeboard Connectors, Card Edge Connectors - Adapters, Solid State Lighting Connectors and Rectangular Connectors - Free Hanging, Panel Mount ...
- Competitive Advantage:
- We specialize in TE Connectivity AMP Connectors 518-AG11D-ES electronic components. 518-AG11D-ES can be shipped within 24 hours after order. If you have any demands for 518-AG11D-ES, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
518-AG11D-ES Product Attributes
Part Number :
518-AG11D-ES
Manufacturer :
TE Connectivity AMP Connectors
Description :
CONN IC DIP SOCKET 18POS GOLD
Series :
500
Part Status :
Active
Type :
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) :
18 (2 x 9)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
25.0µin (0.63µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole
Features :
Closed Frame
Termination :
Solder
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Post :
25.0µin (0.63µm)
Contact Material - Post :
Beryllium Copper
Housing Material :
Polyester
Operating Temperature :
-55°C ~ 125°C
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