Manufacturer :
MG Chemicals
Description :
LEAD FREE NO CLEAN SOLDER PASTE
Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point :
423 ~ 430°F (217 ~ 221°C)
Form :
Syringe, 0.88 oz (25g)
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
35°F ~ 50°F (2°C ~ 10°C)