Manufacturer :
Chip Quik Inc.
Description :
USB - C USB 3.1 GEN 2 SUPERSPE
Proto Board Type :
Connector to DIP
Package Accepted :
USB - C
Board Thickness :
0.062" (1.57mm) 1/16"
Material :
FR4 Epoxy Glass
Size / Dimension :
1.200" L x 0.700" W (30.48mm x 17.78mm)