TSM-116-01-F-SV-P Pricing (USD) [42125pcs Stock]
- 1 pcs$0.92818
- Part Number:
- TSM-116-01-F-SV-P
- Manufacturer:
- Samtec Inc.
- Detailed description:
- CONN HEADER SMD 16POS 2.54MM.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Terminal Blocks - Adapters, Heavy Duty Connectors - Housings, Hoods, Bases, Terminals - Housings, Boots, USB, DVI, HDMI Connectors - Adapters, Terminal Blocks - Accessories, Card Edge Connectors - Accessories, Coaxial Connectors (RF) and Terminal Strips and Turret Boards ...
- Competitive Advantage:
- We specialize in Samtec Inc. TSM-116-01-F-SV-P electronic components. TSM-116-01-F-SV-P can be shipped within 24 hours after order. If you have any demands for TSM-116-01-F-SV-P, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
TSM-116-01-F-SV-P Product Attributes
Part Number :
TSM-116-01-F-SV-P
Manufacturer :
Samtec Inc.
Description :
CONN HEADER SMD 16POS 2.54MM
Series :
TSM
Part Status :
Active
Connector Type :
Header
Contact Type :
Male Pin
Pitch - Mating :
0.100" (2.54mm)
Number of Positions :
16
Number of Rows :
1
Row Spacing - Mating :
-
Number of Positions Loaded :
All
Style :
Board to Board or Cable
Shrouding :
Unshrouded
Mounting Type :
Surface Mount
Termination :
Solder
Fastening Type :
Push-Pull
Contact Length - Mating :
0.230" (5.84mm)
Contact Length - Post :
-
Overall Contact Length :
-
Insulation Height :
0.100" (2.54mm)
Contact Shape :
Square
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
3.00µin (0.076µm)
Contact Finish - Post :
Tin
Contact Material :
Phosphor Bronze
Insulation Material :
Liquid Crystal Polymer (LCP)
Features :
Pick and Place
Operating Temperature :
-55°C ~ 125°C
Ingress Protection :
-
Material Flammability Rating :
UL94 V-0
Insulation Color :
Black
Current Rating :
-
Voltage Rating :
-
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