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PA0195 Product Attributes
Part Number :PA0195
Manufacturer :Chip Quik Inc.
Description :TSSOP-28-EXP-PAD TO DIP-28 SMT
Series :Proto-Advantage
Part Status :Active
Proto Board Type :SMD to DIP
Package Accepted :TSSOP
Number of Positions :28
Pitch :0.026" (0.65mm)
Board Thickness :0.062" (1.57mm) 1/16"
Material :FR4 Epoxy Glass
Size / Dimension :1.000" x 1.400" (25.40mm x 35.56mm)