Part Number :
APF30-30-13CB
Manufacturer :
CTS Thermal Management Products
Description :
HEATSINK LOW-PROFILE FORGED
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Length :
1.181" (30.00mm)
Height Off Base (Height of Fin) :
0.500" (12.70mm)
Power Dissipation @ Temperature Rise :
-
Thermal Resistance @ Forced Air Flow :
2.50°C/W @ 200 LFM
Thermal Resistance @ Natural :
-
Material Finish :
Black Anodized