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PA0193 Product Attributes
Part Number :PA0193
Manufacturer :Chip Quik Inc.
Description :TSSOP-16-EXP-PAD TO DIP-16 SMT
Series :Proto-Advantage
Part Status :Active
Proto Board Type :SMD to DIP
Package Accepted :TSSOP
Number of Positions :16
Pitch :0.026" (0.65mm)
Board Thickness :0.062" (1.57mm) 1/16"
Material :FR4 Epoxy Glass
Size / Dimension :0.700" x 0.800" (17.78mm x 20.32mm)