TSM-119-02-S-SV Pricing (USD) [27106pcs Stock]
- 1 pcs$1.52041
- Part Number:
- TSM-119-02-S-SV
- Manufacturer:
- Samtec Inc.
- Detailed description:
- CONN HEADER SMD 19POS 2.54MM.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Circular Connectors - Accessories, Circular Connectors - Housings, Terminals - Wire to Board Connectors, Coaxial Connectors (RF) - Terminators, Terminal Blocks - Contacts, Card Edge Connectors - Adapters, D-Sub, D-Shaped Connectors - Accessories - Jackscrews and Rectangular Connectors - Accessories ...
- Competitive Advantage:
- We specialize in Samtec Inc. TSM-119-02-S-SV electronic components. TSM-119-02-S-SV can be shipped within 24 hours after order. If you have any demands for TSM-119-02-S-SV, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
TSM-119-02-S-SV Product Attributes
Part Number :
TSM-119-02-S-SV
Manufacturer :
Samtec Inc.
Description :
CONN HEADER SMD 19POS 2.54MM
Series :
TSM
Part Status :
Active
Connector Type :
Header
Contact Type :
Male Pin
Pitch - Mating :
0.100" (2.54mm)
Number of Positions :
19
Number of Rows :
1
Row Spacing - Mating :
-
Number of Positions Loaded :
All
Style :
Board to Board or Cable
Shrouding :
Unshrouded
Mounting Type :
Surface Mount
Termination :
Solder
Fastening Type :
Push-Pull
Contact Length - Mating :
0.320" (8.13mm)
Contact Length - Post :
-
Overall Contact Length :
-
Insulation Height :
0.100" (2.54mm)
Contact Shape :
Square
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish - Post :
Tin
Contact Material :
Phosphor Bronze
Insulation Material :
Liquid Crystal Polymer (LCP)
Features :
-
Operating Temperature :
-55°C ~ 125°C
Ingress Protection :
-
Material Flammability Rating :
UL94 V-0
Insulation Color :
Black
Current Rating :
-
Voltage Rating :
-
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