Part Number :
TS391SNL250
Manufacturer :
Chip Quik Inc.
Description :
THERMALLY STABLE SOLDER PASTE NO
Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point :
423 ~ 428°F (217 ~ 220°C)
Form :
Jar, 8.8 oz (250g)
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
68°F ~ 77°F (20°C ~ 25°C)