Part Number :
550-10-560M33-001152
Description :
BGA SOLDER TAIL
Number of Positions or Pins (Grid) :
560 (33 x 33)
Pitch - Mating :
0.050" (1.27mm)
Contact Finish - Mating :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Material - Mating :
Brass
Mounting Type :
Through Hole
Pitch - Post :
0.050" (1.27mm)
Contact Finish - Post :
Gold
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Post :
Brass
Housing Material :
FR4 Epoxy Glass
Operating Temperature :
-55°C ~ 125°C