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  5. 558-10-500M30-001104

Preci-Dip - 558-10-500M30-001104

KEY Part #: K3342466

558-10-500M30-001104 Pricing (USD) [585pcs Stock]

  • 1 pcs$79.85021
  • 13 pcs$79.45294
Part Number:
558-10-500M30-001104
Manufacturer:
Preci-Dip
Detailed description:
BGA SURFACE MOUNT 1.27MM.
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Photovoltaic (Solar Panel) Connectors, Photovoltaic (Solar Panel) Connectors - Contacts, Terminal Strips and Turret Boards, Keystone - Faceplates, Frames, Terminals - Accessories, Rectangular Connectors - Adapters, Terminals - Knife Connectors and Blade Type Power Connectors - Accessories ...
Competitive Advantage:
We specialize in Preci-Dip 558-10-500M30-001104 electronic components. 558-10-500M30-001104 can be shipped within 24 hours after order. If you have any demands for 558-10-500M30-001104, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

558-10-500M30-001104 Product Attributes

Part Number : 558-10-500M30-001104
Manufacturer : Preci-Dip
Description : BGA SURFACE MOUNT 1.27MM
Series : 558
Part Status : Active
Type : BGA
Number of Positions or Pins (Grid) : 500 (30 x 30)
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Brass
Mounting Type : Surface Mount
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass
Housing Material : FR4 Epoxy Glass
Operating Temperature : -55°C ~ 125°C
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